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Glossary of Terms





CAD  - Computer Aided Design


CAM  - Computer Aided Manufacturing


card-edge connector  -


cathode - 1.  In an electron tube the electrode through which a primary source of electrons enters.

2.  The general name for any negative electrode.   3.  When a semiconductor diode is biased in the forward direction, that terminal of the diode which is negative with respect to the other terminal.  4.  In electrolytic plating, the piece being plated.


CEM-1—A NEMA grade of industrial laminate having a substrate of woven glass surfaces over a cellulose paper core and a resin binder of epoxy


chip-on-board —Abbreviated COB.  In this technology integrated circuits are glued and wire-bonded directly to printed circuit boards instead of first being packaged. The electronics for many mass-produced toys are embedded by this system, which can be identified by the black glob of plastic sitting on the board. Underneath that glob (technical term: glob top ), is a chip with fine wires bonded to both it and the landing pads on the board.


CIM—Computer Integrated Manufacturing


clad - generally referring to the copper film on the surface of the printed circuit board... features in 'etch' are left after the clad has been imaged and etched with acid to remove any undesired copper 'clad'.


Coax - RG cable, or coax as we know it, was developed by Bell Laboratories around WWII.  Aircraft radio systems that required long-wire antennas, as with long range bombers, needed a method to route the signal to either the belly or tail mounted long-wire reels without radiating within the fuselage.  Bell Labs developed it and called this new cable Radio Guide or "RG" cable.


collector—1. The electrode in a transistor that 'collects' electrons


component  - the basic building block of an electrical printed circuit. Typical components are; resistor, capacitor, diode, inductor, switch, integrated circuit, lamp, etc.


connector - a single or multi-pin device allowing modular disconnection of electrical assemblies.


Copper Foil - The electrodeposited copper foil starts with the manufacturing process in which copper dissolved in electrolyte is electrodeposited on to the surface of the revolving drum in the form of a thin foil. In this manufacturing process, various copper foils ranging from general printed wiring boards to sophisticated digital devices are produced according to electrolyzing conditions. In the next process, smoothing and stain-proof processing are executed to pass various reliability tests required by their intended usage. Finally, the copper foils that pass these tests are shipped out in rolls or in sheets.


Manufacture of the original foil ranging in thickness from 6µm to 175µm, depending on the usage.



Surface treatment




Making sheets from rolls and making guide-holes for pin lamination





Sheet copper material





Current  -  The Movement of Electrons through a conductor, 1 Amp = 1 Volt x 1 Ohm


1 AMP = 1 coulomb of charge per second


See Wikipedia definition of Current - http://en.wikipedia.org/wiki/Electric_current









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